Gold Shuttle: Difference between revisions
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Created page with "Goal: run an MVP shuttle run and bring wafers to open sauce 2026 == Previous work == none|thumb none|thumb Above: IIRC used this, but a UVC PR would probably also work Equipment used: * Maasi spin coater ** Production used 2, but you can get away with 1 ** Production configuration: 1 for cleaning, 1 for PR * "ez bake lithography" exposure machine * Masks ** 3d printed frame + transparency * Printer ** I used a las..." |
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Goal: run an MVP shuttle run and bring wafers to open sauce 2026 | Goal: run an MVP shuttle run and bring wafers to open sauce 2026 | ||
TODO: | |||
* Document existing fabrication process better | |||
* Set back up in SF | |||
** Grab ez bake litho system out of storage | |||
** Acquire lab space (WIP) | |||
** Fix sputter coater | |||
* Measure maximum resolution | |||
* Make PDK | |||
* Wafer floorplan | |||
** Probably 3x3 | |||
* Solicit first cohort of contributors | |||
** Start by sourcing from FOSSF discord | |||
== Previous work == | == Previous work == | ||
Latest revision as of 22:09, 20 March 2026
Goal: run an MVP shuttle run and bring wafers to open sauce 2026
TODO:
- Document existing fabrication process better
- Set back up in SF
- Grab ez bake litho system out of storage
- Acquire lab space (WIP)
- Fix sputter coater
- Measure maximum resolution
- Make PDK
- Wafer floorplan
- Probably 3x3
- Solicit first cohort of contributors
- Start by sourcing from FOSSF discord
Previous work


Above: IIRC used this, but a UVC PR would probably also work
Equipment used:
- Maasi spin coater
- Production used 2, but you can get away with 1
- Production configuration: 1 for cleaning, 1 for PR
- "ez bake lithography" exposure machine
- Masks
- 3d printed frame + transparency
- Printer
- I used a laser printer
Simple / existing gold fabrication process:
- Mask fabrication
- Laser printer a couple of times through onto transparency
- Cut to size
- Clean 2" wafer
- Strip photoresist by leaving it in for longer
- Clean with IPA and spin at max speed (8k RPM)
- Sometimes lightly brushed wafer when needed
- Sputter coat gold
- Spin coat PR
- Expose mask
- Develop PR using KOH
- Etch gold using NaI/I
- Clean wafer
- Place into membrane box
Mask exposure using "ez bake lithography"
Some early notes from that can be found here
There are