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Gold Shuttle

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Revision as of 22:07, 20 March 2026 by JohnDMcMaster (talk | contribs) (Created page with "Goal: run an MVP shuttle run and bring wafers to open sauce 2026 == Previous work == none|thumb none|thumb Above: IIRC used this, but a UVC PR would probably also work Equipment used: * Maasi spin coater ** Production used 2, but you can get away with 1 ** Production configuration: 1 for cleaning, 1 for PR * "ez bake lithography" exposure machine * Masks ** 3d printed frame + transparency * Printer ** I used a las...")
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Goal: run an MVP shuttle run and bring wafers to open sauce 2026

Previous work

Above: IIRC used this, but a UVC PR would probably also work


Equipment used:

  • Maasi spin coater
    • Production used 2, but you can get away with 1
    • Production configuration: 1 for cleaning, 1 for PR
  • "ez bake lithography" exposure machine
  • Masks
    • 3d printed frame + transparency
  • Printer
    • I used a laser printer

Simple / existing gold fabrication process:

  • Mask fabrication
    • Laser printer a couple of times through onto transparency
    • Cut to size
  • Clean 2" wafer
    • Strip photoresist by leaving it in for longer
    • Clean with IPA and spin at max speed (8k RPM)
    • Sometimes lightly brushed wafer when needed
  • Sputter coat gold
  • Spin coat PR
  • Expose mask
  • Develop PR using KOH
  • Etch gold using NaI/I
  • Clean wafer
  • Place into membrane box


Mask exposure using "ez bake lithography"

Some early notes from that can be found here

There are